Capabilities
Full fabrication spec, fully transparent.
The numbers we'll hold ourselves to, on every order.
Fabrication Capabilities
Standard production envelope. Reach out for anything outside these ranges, we frequently accommodate special builds.
Number of Layers
1 – 8
Laminate Thickness
0.5 mm – 3.2 mm
Base Materials
FR4 (Tg 135), FR4 (Tg 170), RT/duroid, Teflon
Base Copper Weight
17 µm – 105 µm (½ oz – 3 oz)
Minimum Line Width
0.152 mm (6 mil)
Minimum Spacing
0.152 mm (6 mil)
Inner Layer Min Track
0.10 mm (4 mil)
Minimum Drill Hole
0.25 mm (8 mil)
Minimum Annular Ring
0.10 mm (4 mil)
V-Scoring Tolerance
± 0.075 mm
Hole Position Tolerance
± 0.05 mm
Aspect Ratio
Up to 8:1
Maximum Panel Size
457 mm × 610 mm
Solder Mask Colors
Green, White, Blue, Black, Red
Silkscreen Colors
White, Black, Yellow
Electrical Testing
Flying Probe, Bare Board Test (BBT), Fine Pitch BGA
Optical Inspection
AOI inner & outer layers (4 mil resolution)
Surface Finishes
Choose the right finish for your assembly process and end-use environment.
Finish
Description
Typical Use
HASL (Lead-Free)
RoHS-compliant tin/copper alloy
General-purpose boards, cost-sensitive runs
ENIG
Electroless Nickel Immersion Gold
Fine-pitch BGAs, flat pads, RoHS designs
Electrolytic Gold over Nickel
Hard gold plate, 30–50 µ-in
Edge connectors, key contacts, high-wear pads
Peelable Solder Mask
Temporary masking material
Selective soldering, assembly protection
Need a spec outside the standard envelope?
We frequently accommodate custom builds. Get an instant baseline quote or contact our engineering team.